Integral Technology, Inc., based in Lake Forest, California, is a technology company doing research, design and manufacturing of new materials for broad use in the electronic manufacturing and assembly industry. Solutions include next generation dielectric HDI (high density interconnects) build-up structures and pad cratering resistance. In addition to the materials business, we have a technical support group supporting PCB manufacturers and an OEM marketing group promoting new technologies to the global electronics market.
Why is Zeta® an extraordinary gamechanger?
Zeta Lam allows significant layer count reduction in PCB’s with better signal performance. Having a low Dk combined with very high withstanding voltage, these glass free films change the design rules for via diameter and trace width while still conforming to the manufacturing needs of the PCB shop. Three traces between vias at a 0.4mm pitch is not only possible, but very manufacturable.
To create Zeta® Lam, Zeta® Cap is attached to a B-stage bonding film capable of filling circuits and vias for ultra-thin HDI build-up structures with improved transmission line performance.
Zeta® Cap’s unique liquid cast polyimide film is bonded to copper foil in a high temperature furnace not found in PCB factories. This C-stage layer is laminated to a proprietary B-stage bonding film called Zeta® Bond. The C-stage polyimide film acts like the glass dielectric in conventional prepreg. It provides an ultra-thin, guaranteed copper-to-copper Z-axis standoff as thin as 12 microns with no glass.
Pad cratering, which Zeta® Cap eliminates, is being recognized as a serious and evolving challenge for the PCB industry. It is a mechanically induced fracture in the resin between the copper foil and the outermost layer of fiberglass in a printed circuit board. The pad can remain connected to the component leaving a “crater” on the surface of the PCB board. It is impossible to detect without cross-sectioning a failed board. Zeta® Cap virtually prevents pad cratering, once laminated to the surface as a cap, by acting as a shock absorber to prevent fracture formation. Zeta® Cap, a glass-free laminate produced by Integral Technology (www.integral-hdi.com), a manufacturer of HDI electronic materials for the printed circuit board industry, has received US Patent No. 8,188,373.
Ormet™ sintering materials technology is used within printed circuits boards to provide high electrical, thermal conductivity and adhesion to the PCB substrates. These interlayer electrical interconnects enable a next generation of high density, high performance PCBs by eliminating the need for back-drilling and high-aspect-ratio plated through holes.
Market requirements for hand held mobile and pocketsize devices are driving circuit board technology to stacked microvia interconnect technology. Ormet supplies sintering interconnect materials with process knowledge and Intellectual Property Rights in TLPS technology designed to enable high performance PCB designs. Fabricators using Ormet`s technology are capable of manufacturing micro-via products and high-layer count boards which offer the best signal integrity for high speed transmission.